US 11,787,092 B2
Molding method, molding apparatus, molding system, and article manufacturing method
Hiroshi Sato, Tochigi (JP)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Sep. 28, 2021, as Appl. No. 17/487,307.
Claims priority of application No. 2020-180839 (JP), filed on Oct. 28, 2020.
Prior Publication US 2022/0126488 A1, Apr. 28, 2022
Int. Cl. C23F 1/00 (2006.01); B29C 43/58 (2006.01); B29C 43/20 (2006.01)
CPC B29C 43/58 (2013.01) [B29C 43/203 (2013.01); B29C 2043/5825 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A molding method of molding, using a mold, an uncured composition arranged on a substrate as a film continuously covering a surface of the substrate, comprising:
obtaining unevenness information concerning an unevenness of a surface of an uncured first composition arranged as the film on the substrate;
arranging a droplet of an uncured second composition on a concave portion of the surface of the first composition based on the unevenness information obtained in the obtaining; and
after the arranging the droplet is performed, molding a composition including the film of the first composition and the droplet of the second composition by the mold.