US 11,786,974 B2
Additive manufacturing of electronics having bulk properties
Sameh Dardona, South Windsor, CT (US); and Paul Sheedy, Bolton, CT (US)
Assigned to HAMILTON SUNDSTRAND CORPORATION, Charlotte, NC (US)
Filed by Hamilton Sundstrand Corporation, Charlotte, NC (US)
Filed on May 3, 2018, as Appl. No. 15/970,613.
Prior Publication US 2019/0337054 A1, Nov. 7, 2019
Int. Cl. B22F 12/00 (2021.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B33Y 30/00 (2015.01); B33Y 80/00 (2015.01); B05D 3/06 (2006.01); H05K 3/12 (2006.01); B05D 1/26 (2006.01); H05K 1/09 (2006.01); B05D 1/38 (2006.01); B05D 5/12 (2006.01); B05D 3/02 (2006.01)
CPC B22F 12/00 (2021.01) [B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); B05D 1/26 (2013.01); B05D 1/38 (2013.01); B05D 3/0254 (2013.01); B05D 3/065 (2013.01); B05D 5/12 (2013.01); H05K 1/092 (2013.01); H05K 3/12 (2013.01); H05K 3/125 (2013.01); H05K 3/1208 (2013.01); H05K 3/1241 (2013.01); H05K 3/1283 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method comprising:
providing an electrically insulating substrate;
depositing a quantity of first intermediary material onto the substrate in a pattern corresponding to a desired pattern of a first conductive structure;
adhering the first intermediary material to the substrate to form a first intermediate layer on a portion of the substrate such that the first intermediate layer maintains the desired pattern of the first conductive structure;
depositing a quantity of a precursor of a first electrically conductive material along the pattern of the first intermediate layer; and
providing sufficient energy to at least the quantity of precursor of a first electrically conductive material to enable migration and consolidation of the first electrically conductive material along the pattern of the first intermediate layer, forming a functional, electrically conductive top layer;
wherein at least one of the first electrically conductive material and its precursor has a wetting angle of less than 90° relative to the first intermediate layer, and a wetting angle greater than 90° relative to the substrate; and
wherein at least one of the depositing steps is an additive deposition step.