CPC B22F 3/02 (2013.01) [B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); C08F 220/1808 (2020.02); C09J 7/10 (2018.01); C09J 7/22 (2018.01); C09J 7/30 (2018.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); C09J 133/066 (2013.01); C23C 28/00 (2013.01); C23C 28/04 (2013.01); C23C 28/30 (2013.01); C23C 28/34 (2013.01); H01L 21/3043 (2013.01); H01L 21/52 (2013.01); H01L 21/6836 (2013.01); C08K 2201/001 (2013.01); C09J 2203/326 (2013.01); C09J 2301/408 (2020.08); C09J 2301/41 (2020.08); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/181 (2013.01)] | 4 Claims |
1. A sheet for heat bonding in semiconductor manufacturing, the sheet comprising:
a pre-sintering layer; and
an adhesive layer containing at least an organic binder and metal fine particles, wherein
the pre-sintering layer and the adhesive layer are directly in contact with each other;
the pre-sintering layer contains an organic binder;
the organic binder contained in the pre-sintering layer contains a thermally decomposable binder;
the thermally decomposable binder contained in the pre-sintering layer comprises at least one of polycarbonate, acrylic resin, ethyl cellulose, or polyvinyl alcohol;
the organic binder contained in the adhesive layer contains polycarbonate; and
a content of the metal fine particles contained in the adhesive layer is 10% or more and 30% or less by volume based on the entire adhesive layer.
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