US 11,786,223 B2
Ultrasonic probe with heat dissipation members arranged in center of backing layer
Wataru Sawada, Tokyo (JP); and Toru Watanabe, Tokyo (JP)
Assigned to FUJIFILM HEALTHCARE CORPORATION, Chiba (JP)
Filed by Hitachi, Ltd., Tokyo (JP)
Filed on Mar. 2, 2021, as Appl. No. 17/189,292.
Claims priority of application No. 2020-085104 (JP), filed on May 14, 2020.
Prior Publication US 2021/0353263 A1, Nov. 18, 2021
Int. Cl. A61B 8/00 (2006.01); B06B 1/06 (2006.01); H10N 30/80 (2023.01); H10N 30/87 (2023.01)
CPC A61B 8/546 (2013.01) [A61B 8/4488 (2013.01); B06B 1/067 (2013.01); B06B 1/0622 (2013.01); H10N 30/80 (2023.02); H10N 30/875 (2023.02); B06B 2201/76 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An ultrasonic probe comprising:
a transduction layer in which a plurality of transducers are placed;
a backing layer provided at a rear side of the transduction layer; and
a plurality of heat dissipation members which are provided in the backing layer, wherein the heat dissipation members extend in a line form in the backing layer in a long axis of the ultrasonic probe and are placed with an aligned direction of extension,
wherein an area occupancy percentage of the heat dissipation members relative to the backing layer at a center region of the backing layer in a cross section along a short axis intersecting the long axis is larger than the area occupancy percentage of the heat dissipation members relative to the backing layer at a region at an outer side of the center region.