US 11,786,125 B2
Implantable sensor electronics packaging
George Mikhail, Chester Springs, PA (US); Binh Vu, Thorndale, PA (US); Jochen Walser, Ostermundigen (CH); Dan Dlugos, Middletown, OH (US); Mark Fichman, Eindhoven (NL); Seulki Lee, Eindhoven (NL); Navid Shahriari, Weert (NL); Erfan Sheikhi, Eindhoven (NL); and Maria Op de Beeck, Leuven (BE)
Assigned to DEPUY SYNTHES PRODUCTS, INC., Raynham, MA (US); STITCHTING IMEC NEDERLAND, Eindhoven (NL); and IMEC VZW, Leuven (BE)
Filed by DuPuy Synthes Products, Inc., Raynham, MA (US)
Filed on Dec. 15, 2020, as Appl. No. 17/123,101.
Prior Publication US 2022/0183558 A1, Jun. 16, 2022
Int. Cl. A61B 5/00 (2006.01); A61B 90/00 (2016.01); A61B 5/103 (2006.01); A61B 17/80 (2006.01)
CPC A61B 5/0031 (2013.01) [A61B 5/1036 (2013.01); A61B 17/80 (2013.01); A61B 90/06 (2016.02); A61B 2090/064 (2016.02)] 20 Claims
OG exemplary drawing
 
1. An implantable device adapted for use within a living subject, the device comprising:
a substrate;
a sealed enclosure having a plurality of walls defining an inner enclosure volume therebetween, the sealed enclosure comprising a plurality of electrical interconnects, each electrical interconnect extending through one of the plurality of walls;
an electronic component assembly (ECA) provided within the inner enclosure volume, the ECA being electrically coupled to each of the electrical interconnects;
a flexible circuit board assembly (FCBA) provided external to the sealed enclosure and in contact with the substrate, the FCBA being electrically coupled to each of the electrical interconnects such that the FCBA is in electrical communication with the ECA through the sealed enclosure, the FCBA further including:
at least one transducer operative to monitor a physical characteristic of the substrate and alter an electrical parameter accessible to the ECA in response to the monitored physical characteristic; and
a protective cover coupled to the substrate to define an enclosed sensor volume therebetween, and wherein the sealed enclosure and FCBA are both located within the enclosed sensor volume.