US 10,433,426 B2
Circuit board and method for manufacturing the same
Po-Hsuan Liao, Taoyuan (TW)
Filed by Unimicron Technology Corp., Taoyuan (TW)
Filed on Dec. 11, 2017, as Appl. No. 15/836,941.
Claims priority of application No. 106136765 A (TW), filed on Oct. 25, 2017.
Prior Publication US 2019/0124775 A1, Apr. 25, 2019
Int. Cl. H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/10 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01)
CPC H05K 3/107 (2013.01) [H05K 1/0298 (2013.01); H05K 1/11 (2013.01); H05K 3/0023 (2013.01); H05K 3/0041 (2013.01); H05K 3/4644 (2013.01); H05K 1/0219 (2013.01); H05K 1/0284 (2013.01); H05K 2201/0195 (2013.01); H05K 2203/06 (2013.01)] 3 Claims
OG exemplary drawing
1. A circuit board, comprising:
a substrate;
a first dielectric layer disposed on the substrate;
an adhesive layer bonded to the first dielectric layer and having a top surface opposite to the substrate;
a second dielectric layer disposed on the adhesive layer and having at least one first through hole;
a first conductive line located in the first through hole of the second dielectric layer, wherein a lowermost surface of the first conductive line is in contact with the top surface of the adhesive layer and the first conductive line is above an entirety of the adhesive layer; and
a plurality of second conductive lines penetrating through the adhesive layer and the second dielectric layer and being in contact with the first dielectric layer, wherein the first conductive line is located between adjacent two of the second conductive lines.