US 10,433,423 B2
Method for manufacturing circuit board, and circuit board
Tsuyoshi Sakita, Yokkaichi (JP)
Assigned to SUMITOMO WIRING SYSTEMS, LTD., Mie (JP)
Appl. No. 16/75,044
Filed by SUMITOMO WIRING SYSTEMS, LTD., Yokkaichi-shi, Mie (JP)
PCT Filed Mar. 14, 2017, PCT No. PCT/JP2017/010089
§ 371(c)(1), (2) Date Aug. 2, 2018,
PCT Pub. No. WO2017/163996, PCT Pub. Date Sep. 28, 2017.
Claims priority of application No. 2016-056687 (JP), filed on Mar. 22, 2016.
Prior Publication US 2019/0045631 A1, Feb. 7, 2019
Int. Cl. H05K 1/14 (2006.01); H01R 4/02 (2006.01); H01R 12/71 (2011.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01)
CPC H05K 1/14 (2013.01) [H01R 4/02 (2013.01); H01R 12/716 (2013.01); H05K 1/144 (2013.01); H05K 3/306 (2013.01); H05K 3/34 (2013.01); H05K 1/141 (2013.01); H05K 1/18 (2013.01); H05K 3/0052 (2013.01); H05K 3/0097 (2013.01); H05K 2201/042 (2013.01); H05K 2201/0909 (2013.01); H05K 2201/09127 (2013.01); H05K 2201/10295 (2013.01); H05K 2201/10303 (2013.01); H05K 2203/1484 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A circuit board in which a main substrate has a first surface and a second surface, a terminal fitting and an electronic component are soldered to the first surface, a sub substrate has a first surface and a second surface and is arranged on a second surface side of the main substrate with a predetermined gap therebetween, two ends of a relay terminal are respectively soldered to and span between the first surface of the sub substrate and the second surface of the main substrate, and a separated surface is formed at a predetermined side edge of the main substrate and a predetermined side edge of the sub substrate, wherein the separated surface is a surface formed by disconnecting the main substrate and the sub substrate from a state of being physically connected in the same plane.