US 10,433,387 B2
Light emitting device and light emitting and receiving device
Hiromi Fujita, Tokyo (JP); and Yoshiki Sakurai, Tokyo (JP)
Assigned to Asahi Kasei Microdevices Corporation, Tokyo (JP)
Filed by ASAHI KASEI MICRODEVICES CORPORATION, Tokyo (JP)
Filed on Dec. 21, 2017, as Appl. No. 15/850,380.
Claims priority of application No. 2016-255817 (JP), filed on Dec. 28, 2016; application No. 2017-242460 (JP), filed on Dec. 19, 2017; and application No. 2017-242461 (JP), filed on Dec. 19, 2017.
Prior Publication US 2018/0184497 A1, Jun. 28, 2018
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 31/0203 (2014.01); H05B 33/08 (2006.01); H01L 31/02 (2006.01); H01L 31/16 (2006.01); H01L 31/167 (2006.01); G01N 25/56 (2006.01); H01L 31/0216 (2014.01); H05B 33/04 (2006.01); H05B 37/02 (2006.01); G01B 11/14 (2006.01); G01J 5/10 (2006.01); G01N 21/3504 (2014.01)
CPC H05B 33/0854 (2013.01) [G01B 11/14 (2013.01); G01N 25/56 (2013.01); H01L 31/0203 (2013.01); H01L 31/02019 (2013.01); H01L 31/02162 (2013.01); H01L 31/162 (2013.01); H01L 31/167 (2013.01); H05B 33/04 (2013.01); H05B 33/0842 (2013.01); H05B 33/0851 (2013.01); H05B 33/0872 (2013.01); H05B 37/0227 (2013.01); G01J 5/10 (2013.01); G01N 21/3504 (2013.01); G01N 2201/1211 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A light emitting device comprising:
a light emitting element;
a molded resin portion configured to seal at least a portion of the light emitting element;
a temperature information acquiring unit configured to acquire temperature information;
a humidity information calculating unit configured to calculate humidity information, based on information relating to at least either electrical characteristics or optical characteristics of the light emitting element and the temperature information;
a controlling unit configured to control the light emitting element, based on the temperature information and the humidity information; and
an auxiliary element at least a portion of which is sealed by the molded resin portion, wherein
the light emitting element is disposed to be influenced by a stress of the molded resin portion,
the temperature information includes information relating to temperature of the light emitting element or temperature of the molded resin portion, and the humidity information includes information relating to humidity of the molded resin portion based on change in swelling stress, and
at least either the temperature information or the humidity information includes information relating to at least either electrical characteristics or optical characteristics of the auxiliary element.