US 10,426,038 B2
Manufacturing method of circuit board
Shih-Lian Cheng, New Taipei (TW)
Assigned to Unimicron Technology Corp., Taoyuan (TW)
Filed by Unimicron Technology Corp., Taoyuan (TW)
Filed on Sep. 6, 2016, as Appl. No. 15/256,759.
Claims priority of provisional application 62/309,930, filed on Mar. 17, 2016.
Prior Publication US 2017/0273190 A1, Sep. 21, 2017
Int. Cl. H05K 3/06 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 3/46 (2006.01); G03F 7/00 (2006.01)
CPC H05K 3/064 (2013.01) [G03F 7/0002 (2013.01); G03F 7/162 (2013.01); G03F 7/20 (2013.01); H05K 1/115 (2013.01); H05K 3/0023 (2013.01); H05K 3/06 (2013.01); H05K 3/108 (2013.01); H05K 3/465 (2013.01); H05K 3/4644 (2013.01); H05K 2201/091 (2013.01); H05K 2203/0108 (2013.01); H05K 2203/0369 (2013.01); H05K 2203/0502 (2013.01); H05K 2203/0548 (2013.01); H05K 2203/0562 (2013.01); Y10T 29/49124 (2015.01); Y10T 29/49155 (2015.01)] 13 Claims
OG exemplary drawing
 
1. A manufacturing method of a circuit board, comprising:
providing a dielectric substrate, wherein a circuit pattern, a dielectric layer covering the circuit pattern, and a conductive via located in the dielectric layer and connected to the circuit pattern are disposed on the dielectric substrate;
forming a thermal-sensitive adhesive layer on the dielectric layer;
forming a photoresist material layer on the thermal-sensitive adhesive layer;
performing imprinting on the photoresist material layer via a stamp, wherein a first conductive layer is disposed on a surface of a pressing side of the stamp facing the circuit pattern, a second conductive layer is disposed on a surface of other portions of the stamp, and a resistance of the first conductive layer is greater than a resistance of the second conductive layer;
applying a current to the stamp;
removing the stamp and the photoresist material layer and the thermal-sensitive adhesive layer below the pressing side to form a patterned photoresist layer and a patterned thermal-sensitive adhesive layer;
forming a patterned metal layer on a region exposed by the patterned photoresist layer;
removing the patterned photoresist layer;
heating the patterned thermal-sensitive adhesive layer to reduce the adhesion of the patterned thermal-sensitive adhesive layer; and
after heating the patterned thermal-sensitive adhesive layer, removing the patterned thermal-sensitive adhesive layer.