US 11,758,798 B2
Display device and method of manufacturing the same
Wang Woo Lee, Osan-si (KR); Sung Ho Kim, Suwon-si (KR); Hyeon Sik Kim, Yongin-si (KR); Joon Hyoung Park, Seongnam-si (KR); Seok Je Seong, Seongnam-si (KR); Jin Sung An, Suwon-si (KR); Jin Seok Oh, Pyeongtaek-si (KR); Min Woo Woo, Seoul (KR); Ji Seon Lee, Hwaseong-si (KR); Pil Suk Lee, Suwon-si (KR); and Yun Sik Joo, Goyang-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed by Samsung Display Co., LTD., Yongin-si (KR)
Filed on Jan. 6, 2021, as Appl. No. 17/142,818.
Claims priority of application No. 10-2020-0023624 (KR), filed on Feb. 26, 2020.
Prior Publication US 2021/0265579 A1, Aug. 26, 2021
Int. Cl. H01L 27/32 (2006.01); H10K 77/10 (2023.01); H10K 59/131 (2023.01); H10K 59/121 (2023.01); H10K 71/00 (2023.01); H10K 71/80 (2023.01); H01L 27/12 (2006.01); H01L 29/786 (2006.01); H01L 29/66 (2006.01); H10K 59/12 (2023.01); H10K 102/00 (2023.01)
CPC H10K 77/111 (2023.02) [H10K 59/1213 (2023.02); H10K 59/131 (2023.02); H10K 71/00 (2023.02); H10K 71/80 (2023.02); H01L 27/124 (2013.01); H01L 27/127 (2013.01); H01L 27/1218 (2013.01); H01L 27/1225 (2013.01); H01L 27/1251 (2013.01); H01L 27/1266 (2013.01); H01L 27/1288 (2013.01); H01L 29/66757 (2013.01); H01L 29/66969 (2013.01); H01L 29/7869 (2013.01); H01L 29/78675 (2013.01); H10K 59/1201 (2023.02); H10K 2102/311 (2023.02)] 4 Claims
OG exemplary drawing
 
1. A display device comprising:
a supporting substrate including a polymeric material;
a base substrate disposed on an upper surface of the supporting substrate, the base substrate including:
an organic film including a polymeric material; and
an inorganic barrier film overlapping the organic film, a width of a portion of the inorganic barrier film extending outwardly from an edge of the organic film;
a pixel array disposed in a display area of the base substrate;
a transfer wiring disposed in a bending area of the base substrate and electrically connected to the pixel array; and
an organic filling portion disposed under the transfer wiring in the bending area and contacting the organic film of the base substrate.