US 11,758,698 B2
Power semiconductor cooling module for electric vehicle
Hwan Ku Lee, Gimpo-si (KR)
Assigned to AMOGREENTECH CO., LTD., Gimpo-si (KR)
Appl. No. 17/433,057
Filed by AMOGREENTECH CO., LTD., Gimpo-si (KR)
PCT Filed Feb. 20, 2020, PCT No. PCT/KR2020/002445
§ 371(c)(1), (2) Date Aug. 23, 2021,
PCT Pub. No. WO2020/175848, PCT Pub. Date Sep. 3, 2020.
Claims priority of application No. 10-2019-0021786 (KR), filed on Feb. 25, 2019; and application No. 10-2020-0020269 (KR), filed on Feb. 19, 2020.
Prior Publication US 2022/0167525 A1, May 26, 2022
Int. Cl. H05K 7/20 (2006.01); H05K 5/02 (2006.01)
CPC H05K 7/209 (2013.01) [H05K 5/0217 (2013.01); H05K 7/20854 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A power semiconductor cooling module for an electric vehicle, which is electrically connected to a motor, comprising:
a housing part formed in a box shape having an internal space;
a power element part disposed in the internal space and electrically connected to the motor through a bus bar;
a heat sink disposed in the internal space to be in contact with the power element part;
a cooling unit configured to cool the heat sink; and
a heat reflux prevention member disposed to surround the bus bar and disposed to be in contact with the cooling unit,
wherein the bus bar includes a first end electrically connected to the power element part and a second end exposed outside of the housing part,
wherein the heat reflux prevention member is disposed to be in contact with the cooling unit while surrounding a circumference of the bus bar between the first end and the second end so as to block the heat generated from the motor from being transferred to the power element part through the bus bar, and
wherein the heat reflux prevention member is directly cooled by the cooling unit.