CPC H05K 7/205 (2013.01) [H05K 1/0204 (2013.01); H05K 1/185 (2013.01)] | 13 Claims |
1. An electronic device, comprising:
a heat-generating structure including a substrate and an electronic component disposed on said substrate; and
a heat dissipation structure including
a heat dissipation unit that includes a heat dissipation body and an anti-corrosion layer formed on said heat dissipation body (121),
a liquid metal layer disposed between said electronic component and said anti-corrosion layer and opposite to said heat dissipation body, and
a blocking member that is disposed between said substrate and said anti-corrosion layer, that is connected to said anti-corrosion layer, and that surrounds said liquid metal layer and said electronic component.
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