US 11,758,691 B2
Heat dissipation structure and electronic device adopting the same
Chiu-Lang Lin, Kaohsiung (TW)
Assigned to MORNINGRICH TECHNOLOGY CO., LTD., Kaohsiung (TW)
Filed by Morningrich Technology Co., Ltd., Kaohsiung (TW)
Filed on Apr. 26, 2021, as Appl. No. 17/240,441.
Claims priority of application No. 109204988 (TW), filed on Apr. 27, 2020; and application No. 110202467 (TW), filed on Mar. 9, 2021.
Prior Publication US 2021/0337696 A1, Oct. 28, 2021
Int. Cl. H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC H05K 7/205 (2013.01) [H05K 1/0204 (2013.01); H05K 1/185 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a heat-generating structure including a substrate and an electronic component disposed on said substrate; and
a heat dissipation structure including
a heat dissipation unit that includes a heat dissipation body and an anti-corrosion layer formed on said heat dissipation body (121),
a liquid metal layer disposed between said electronic component and said anti-corrosion layer and opposite to said heat dissipation body, and
a blocking member that is disposed between said substrate and said anti-corrosion layer, that is connected to said anti-corrosion layer, and that surrounds said liquid metal layer and said electronic component.