CPC H05K 1/115 (2013.01) [H01R 13/6658 (2013.01); H05K 1/117 (2013.01); H05K 1/145 (2013.01)] | 6 Claims |
1. An interconnection system comprising:
a surface mount component comprising surface mount leads; and
a printed circuit board comprising conductive layers separated by dielectric layers, and vias configured for solder attachment to respective leads of the surface mount component, each of the vias including a conductive element having a recess in an upper surface thereof, wherein the recess in the conductive element is smaller in diameter than a surface mount lead of the surface mount leads and receives only a tip portion of the surface mount lead.
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