US 11,758,653 B2
Printed circuit board
Sang Hoon Kim, Suwon-si (KR); Yong Duk Lee, Suwon-si (KR); and Duck Young Maeng, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Apr. 5, 2021, as Appl. No. 17/222,528.
Claims priority of application No. 10-2020-0164562 (KR), filed on Nov. 30, 2020.
Prior Publication US 2022/0174816 A1, Jun. 2, 2022
Int. Cl. H05K 1/11 (2006.01)
CPC H05K 1/113 (2013.01) [H05K 2201/09563 (2013.01)] 29 Claims
OG exemplary drawing
 
1. A printed circuit board comprising:
a first substrate portion including a first insulating layer and a first wiring layer; and
a second substrate portion disposed on the first substrate portion and including a second insulating layer, a pad disposed on an upper outer surface of the second insulating layer, and a first via penetrating through the second insulating layer and connecting the first wiring layer and the pad to each other,
wherein the first via has a boundary with each of the first wiring layer and the pad, and includes a first metal layer and a second metal layer disposed on different levels, and
the first wiring layer directly contacts a lower surface of the second insulating layer.