US 11,758,255 B2
Camera module and manufacturing method thereof
Zhen Huang, Ningbo (CN); Qimin Mei, Ningbo (CN); Bojie Zhao, Ningbo (CN); Zhewen Mei, Ningbo (CN); Li Liu, Ningbo (CN); Jiawei Chen, Ningbo (CN); Zongchun Yang, Ningbo (CN); and Chenxiang Xu, Ningbo (CN)
Assigned to NINGBO SUNNY OPOTECH CO., LTD., Zhejiang Province (CN)
Filed by NINGBO SUNNY OPOTECH CO., LTD., Ningbo (CN)
Filed on May 23, 2022, as Appl. No. 17/750,743.
Application 17/750,743 is a continuation of application No. 17/195,785, filed on Mar. 9, 2021, granted, now 11,412,116.
Application 17/195,785 is a continuation of application No. 16/547,537, filed on Aug. 21, 2019, granted, now 10,986,257, issued on Apr. 20, 2021.
Claims priority of application No. 201810952770.4 (CN), filed on Aug. 21, 2018; application No. 201821351551.2 (CN), filed on Aug. 21, 2018; application No. 201910438885.6 (CN), filed on May 24, 2019; application No. 201910438917.2 (CN), filed on May 24, 2019; application No. 201910439285.1 (CN), filed on May 24, 2019; application No. 201920764689.3 (CN), filed on May 24, 2019; application No. 201920765166.0 (CN), filed on May 24, 2019; and application No. 201920766441.0 (CN), filed on May 24, 2019.
Prior Publication US 2022/0360694 A1, Nov. 10, 2022
Int. Cl. H04N 23/55 (2023.01); B29C 43/18 (2006.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01); B29L 11/00 (2006.01); B29L 31/34 (2006.01)
CPC H04N 23/55 (2023.01) [B29C 43/18 (2013.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01); B29L 2011/00 (2013.01); B29L 2031/34 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A camera module, characterized by comprising:
an optical lens;
a filter chip; and
a molded photosensitive assembly including a main body, a photosensitive chip, and a circuit board electrically connected with the photosensitive chip, wherein the main body is integrally molded on the circuit board, and includes a container body at at least one side of the photosensitive chip and a lower body at more sides than the at least one side of the photosensitive chip and extended integrally from an inner side of the container body at the at least one side, and there is a certain height difference between the container body and the lower body, and the filter chip is provided on the lower body, and a part of the optical lens is provided on the container body;
wires connected with the circuit board and provided at at least one side of the photosensitive chip and embedded by the lower body;
a plurality of electronic components including at least one low component, wherein at least a part of the low component is embedded by the lower body, and the wires and the low component are at different side of the photosensitive chip respectively.