CPC H04N 23/55 (2023.01) [B29C 43/18 (2013.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01); B29L 2011/00 (2013.01); B29L 2031/34 (2013.01)] | 20 Claims |
1. A camera module, characterized by comprising:
an optical lens;
a filter chip; and
a molded photosensitive assembly including a main body, a photosensitive chip, and a circuit board electrically connected with the photosensitive chip, wherein the main body is integrally molded on the circuit board, and includes a container body at at least one side of the photosensitive chip and a lower body at more sides than the at least one side of the photosensitive chip and extended integrally from an inner side of the container body at the at least one side, and there is a certain height difference between the container body and the lower body, and the filter chip is provided on the lower body, and a part of the optical lens is provided on the container body;
wires connected with the circuit board and provided at at least one side of the photosensitive chip and embedded by the lower body;
a plurality of electronic components including at least one low component, wherein at least a part of the low component is embedded by the lower body, and the wires and the low component are at different side of the photosensitive chip respectively.
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