US 11,758,253 B2
Camera module having chamfer, photosensitive assembly, preparation method, and electronic device
Bojie Zhao, Zhejiang (CN); Dongli Yuan, Zhejiang (CN); Zhen Huang, Zhejiang (CN); QiMin Mei, Zhejiang (CN); and Zhenyu Chen, Zhejiang (CN)
Assigned to NINGBO SUNNY OPOTECH CO., LTD., Zhejiang (CN)
Appl. No. 17/43,381
Filed by Ningbo Sunny Opotech Co., Ltd., Zhejiang (CN)
PCT Filed Apr. 12, 2019, PCT No. PCT/CN2019/082418
§ 371(c)(1), (2) Date Sep. 29, 2020,
PCT Pub. No. WO2019/201167, PCT Pub. Date Oct. 24, 2019.
Claims priority of application No. 201810342290.6 (CN), filed on Apr. 17, 2018; and application No. 201820543430.1 (CN), filed on Apr. 17, 2018.
Prior Publication US 2021/0051249 A1, Feb. 18, 2021
Int. Cl. H04N 23/54 (2023.01); H04N 23/51 (2023.01); H04N 23/55 (2023.01); H04N 23/57 (2023.01); G03B 17/02 (2021.01)
CPC H04N 23/54 (2023.01) [G03B 17/02 (2013.01); H04N 23/51 (2023.01); H04N 23/55 (2023.01); H04N 23/57 (2023.01)] 19 Claims
OG exemplary drawing
 
1. A photosensitive assembly for a camera module having a chamfer comprising:
a photosensitive element;
a circuit board including a circuit board chamfer, the photosensitive element being electrically connected and attached to the circuit board; and
a molded body including a light window providing a light path for the photosensitive element and a molded body chamfer,
wherein the molded body chamfer and the circuit board chamfer are correspondingly arranged to form a first chamfer portion with a round shape that matches a round shape of a corner of the camera module and is different from a non-round shape of other corners of the camera module which does not match the round shape of the corner of the camera module,
the round shape of the corner of the camera module is suitable for being installed at a corner of an outer frame of an electronic device with a round shape which is directly contactable or visible by a user when the electronic device is used such that the round shape of the corner of the outer frame of the electronic device is closer to the round shape of the first chamfer portion than the non-round shape of the other corners of the camera module, and
the molded body is molded on the circuit board and encapsulates the photosensitive element.