CPC H04N 23/51 (2023.01) [B60R 1/00 (2013.01); B60R 11/04 (2013.01); G03B 17/02 (2013.01); G03B 29/00 (2013.01); H04N 23/00 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); G03B 2217/002 (2013.01); H04M 1/0264 (2013.01); H04N 23/57 (2023.01)] | 15 Claims |
1. A camera module comprising:
a housing comprising a through hole;
a lens module disposed in the through hole;
a connector penetrating the housing and extending to an outside from an inside of the housing;
a first substrate unit located inside the housing and having an image sensor mounted thereon; and
a second substrate unit disposed inside the housing and connected to the connector;
wherein the first substrate unit includes a first substrate portion having an upper surface on which the image sensor is disposed, and a second substrate portion disposed below the first substrate portion and connected to the second substrate unit,
wherein a space within the housing includes a first space in which the first substrate portion is disposed, and a second space in which the second substrate portion is disposed,
wherein a cross-sectional area of the first substrate portion is smaller than a cross-sectional area of the second substrate portion, and
wherein a cross-sectional area of the first space is smaller than a cross-sectional area of the second space.
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