CPC H04B 1/04 (2013.01) [H03F 1/56 (2013.01); H03F 3/245 (2013.01); H03F 2200/171 (2013.01); H03F 2200/222 (2013.01); H03F 2200/451 (2013.01); H04B 2001/0408 (2013.01)] | 10 Claims |
1. A radio frequency module, comprising
a module board that includes a first principal surface and a second principal surface on opposite sides of the module board;
a power amplifier configured to amplify a transmission signal; and
an external-connection terminal disposed on the second principal surface;
wherein the power amplifier includes:
a first amplifying circuit element;
a second amplifying circuit element; and
an output transformer that includes a first coil and a second coil,
an end of the first coil is connected to an output terminal of the first amplifying circuit element,
another end of the first coil is connected to an output terminal of the second amplifying circuit element,
an end of the second coil is connected to an output terminal of the power amplifier,
the output transformer is a chip inductor and disposed on the second principal surface.
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