US 11,757,425 B2
Resonance device and method for producing resonance device
Masakazu Fukumitsu, Nagaokakyo (JP); and Kentarou Dehara, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on May 27, 2020, as Appl. No. 16/884,401.
Application 16/884,401 is a continuation of application No. PCT/JP2018/034266, filed on Sep. 14, 2018.
Claims priority of application No. 2018-023946 (JP), filed on Feb. 14, 2018.
Prior Publication US 2020/0295732 A1, Sep. 17, 2020
Int. Cl. H03H 9/10 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H03H 3/007 (2006.01); H03H 9/24 (2006.01)
CPC H03H 9/1057 (2013.01) [B81B 7/0038 (2013.01); B81C 1/00285 (2013.01); H03H 3/0072 (2013.01); H03H 9/2457 (2013.01); B81B 2201/0271 (2013.01); B81C 2203/0118 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A resonance device, comprising:
a first substrate including a resonator;
a second substrate; and
a bonding portion bonding the first substrate to the second substrate so as to seal a vibration space of the resonator,
wherein the bonding portion includes a eutectic layer composed of a eutectic alloy of germanium and a metal mainly containing aluminum, a first titanium layer, a first aluminum oxide film, and a first conductive layer consecutively arranged from the first substrate to the second substrate.