US 11,757,204 B2
Single substrate ultra-wideband antenna and antenna array
Markus Novak, Dublin, OH (US); Ahmed Hassan Abdelaziz Abdelrahman, Cary, NC (US); Zhengxiang Ma, Summit, NJ (US); Munawar Kermalli, Morris Plains, NJ (US); and Leonard Piazzi, Denville, NJ (US)
Assigned to Futurewei Technologies, Inc., Plano, TX (US); and Novaa Ltd., Columbus, OH (US)
Filed by Futurewei Technologies, Inc., Plano, TX (US); and Novaa Ltd., Columbus, OH (US)
Filed on Feb. 22, 2022, as Appl. No. 17/677,261.
Application 17/677,261 is a continuation of application No. PCT/US2019/047702, filed on Aug. 22, 2019.
Prior Publication US 2022/0181790 A1, Jun. 9, 2022
Int. Cl. H01Q 21/00 (2006.01); H01Q 5/314 (2015.01); H01Q 5/25 (2015.01); H01Q 1/42 (2006.01)
CPC H01Q 21/0043 (2013.01) [H01Q 1/424 (2013.01); H01Q 5/25 (2015.01); H01Q 5/314 (2015.01)] 22 Claims
OG exemplary drawing
 
1. A modular wideband antenna comprising:
a ground plane;
a first antenna element and a second antenna element disposed on a first surface of a substrate;
a first portion of a two-layer feed balun disposed on the first surface of the substrate, the first portion of the two-layer feed balun being electrically coupled to the first and second antenna elements, and the first portion of the two-layer feed balun being electrically coupled to the ground plane;
a second portion of the two-layer feed balun disposed on a second surface of the substrate, the second portion of the two-layer feed balun being electrically coupled to a signal feed, and the second portion of the two-layer feed balun being capacitively coupled to the first portion of the two-layer feed balun;
a first coupling capacitance and a second coupling capacitance disposed on the second surface of the substrate, the first coupling capacitance being capacitively coupled to the first antenna element, and the second coupling capacitance being capacitively coupled to the second antenna element; and
a first grounding post and a second grounding post, the first grounding post being electrically coupled to the first coupling capacitance and the ground plane, the second grounding post being electrically coupled to the second coupling capacitance and the ground plane.