US 11,757,080 B2
Multi-sided light-emitting circuit board and manufacturing method thereof
Zu-Ai Li, Shenzhen (CN); Mei-Hua Huang, Shenzhen (CN); Jin-Cheng Wu, Huai an (CN); Si-Hong He, Shenzhen (CN); and Ning Hou, Shenzhen (CN)
Assigned to Avary Holding (Shenzhen) Co., Limited., Shenzhen (CN); and QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Huai an (CN)
Appl. No. 17/260,515
Filed by Avary Holding (Shenzhen) Co., Limited., Shenzhen (CN); and QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD, Huai an (CN)
PCT Filed Nov. 27, 2019, PCT No. PCT/CN2019/121289
§ 371(c)(1), (2) Date Jan. 14, 2021,
PCT Pub. No. WO2021/102742, PCT Pub. Date Jun. 3, 2021.
Prior Publication US 2021/0384394 A1, Dec. 9, 2021
Int. Cl. H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01); H01L 33/38 (2010.01); H01L 33/54 (2010.01)
CPC H01L 33/62 (2013.01) [H01L 25/0753 (2013.01); H01L 33/005 (2013.01); H01L 33/38 (2013.01); H01L 33/54 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0066 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A method for manufacturing a multi-sided light-emitting circuit board, the method comprising the following steps:
providing a copper-clad substrate, the copper-clad substrate comprising a transparent substrate layer and a first copper foil layer on at least one surface of the transparent substrate layer;
forming the first copper foil layer into a first conductive circuit layer, the first conductive circuit layer revealing a portion of the transparent substrate layer, and the first conductive circuit layer comprising a plurality of conductive portions arranged in an array;
forming a metal piece on each of the conductive portions, a size of each metal piece smaller than a size of the conductive portion connected to the metal piece, and adjacent metal pieces spaced apart to form an accommodation space;
forming a transparent glue layer on a surface of the transparent substrate layer and in spaces formed by the conductive portions, the glue layer flush with the first conductive circuit layer;
providing light-emitting chip, the light-emitting chip comprising two electrodes, the two electrodes respectively located at opposite ends of the light-emitting chip, and the light-emitting chip arranged in the accommodating space so that the two electrodes at the opposite ends of the light-emitting chip are electrically connected to two adjacent metal pieces; and
forming an encapsulant layer on a surface of the first conductive circuit layer, the encapsulant layer encapsulating the metal pieces and the light-emitting chips;
wherein after the glue layer is formed and before mounting the light-emitting chip to sidewalls of every two adjacent metal pieces, the method further comprises:
forming a conductive paste on each of the conductive portions, the conductive paste surrounding a sidewall of the metal piece connected to the conductive portion; and
after the light-emitting chip is mounted on the sidewalls of each two adjacent metal pieces, performing a reflow soldering step, so that the light-emitting chip and the conductive paste are electrically connected.