US 11,757,075 B2
Silica glass member for hermetic sealing of ultraviolet SMD LED element and method for manufacturing quartz glass member for ultraviolet led
Akira Fujinoki, Tokyo (JP); Hiroyuki Nishimura, Koriyama (JP); Akira Sato, Koriyama (JP); Yuya Yokosawa, Koriyama (JP); and Tatsuya Mori, Koriyama (JP)
Assigned to SHIN-ETSU QUARTZ PRODUCTS CO., LTD., Tokyo (JP)
Filed by SHIN-ETSU QUARTZ PRODUCTS CO., LTD., Tokyo (JP)
Filed on Dec. 22, 2021, as Appl. No. 17/559,031.
Application 17/559,031 is a division of application No. 16/306,185, previously published as PCT/JP2017/018817, filed on May 19, 2017.
Claims priority of application No. 2016-110033 (JP), filed on Jun. 1, 2016; and application No. 2016-131887 (JP), filed on Jul. 1, 2016.
Prior Publication US 2022/0115570 A1, Apr. 14, 2022
Int. Cl. H01L 33/58 (2010.01); C03B 19/06 (2006.01); H01L 25/075 (2006.01); H01L 33/48 (2010.01); C03C 3/06 (2006.01); C03C 4/00 (2006.01); H01L 33/32 (2010.01)
CPC H01L 33/58 (2013.01) [C03B 19/066 (2013.01); C03C 3/06 (2013.01); C03C 4/0085 (2013.01); H01L 25/0753 (2013.01); H01L 33/486 (2013.01); C03B 2201/04 (2013.01); C03C 2201/23 (2013.01); H01L 33/32 (2013.01); H01L 2933/0058 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A silica glass member for hermetic sealing of an ultraviolet SMD LED element that is configured to emit light in a wavelength range of from 250 nm to 350 nm and is placed in a hermetic sealing container having a container outer periphery joining plain surface formed in an outer peripheral portion thereof, the silica glass member for hermetic sealing comprising:
a silica glass substrate, which is homogeneously and integrally formed without an internal boundary, wherein the silica glass substrate has:
a first surface on an inside opposed to the SMD LED element; and
a second surface on an outside corresponding to the first surface, wherein an outer peripheral portion of the first surface has formed therein a substrate joining plain surface for joining to the container outer periphery joining plain surface, and the second surface on the outside corresponding to the first surface has formed therein a lens convex portion configured to process emitted light from the ultraviolet SMD LED element, wherein the substrate joining plain surface formed in the first surface has a surface accuracy equal to 1 μm or less and a surface roughness of 0.05 μm to 0.3 μm in terms of Ra value, and the lens convex portion in the second surface has a surface roughness of 0.05 μm to 0.5 μm in terms of Ra value.