CPC H01L 33/005 (2013.01) [B05C 11/00 (2013.01)] | 18 Claims |
1. A system for processing a semiconductor substrate, comprising:
a substrate support configured to carry a microelectronic workpiece comprising a plurality of light emitting diodes (LEDs);
a plurality of containers, each of the plurality of containers holding a different converter material;
a mixer operatively coupled to the plurality of containers, the mixer configured to regulate at least one of a concentration and a flow rate of the converter materials out of the plurality of containers;
an injector positioned to introduce one or more of the converter materials from the mixer onto the plurality of LEDs of the microelectronic workpiece; and
a controller operatively coupled to the mixer and the injector, the controller having a computer-readable storage medium containing instructions which, when executed, cause the controller to perform a method comprising:
measuring a base emission characteristic of each of the plurality of LEDs on the microelectronic workpiece;
developing an emission map of the plurality of LEDs based at least partially on the measured base emission characteristics; and
causing the injector to introduce the one or more of the converter materials onto each of the plurality of LEDs based on the emission map and a compensation scheme,
wherein the one or more of the converter materials introduced onto each of the plurality of LEDs include at least one converter material with a converter emission wavelength opposite a black body curve in a chromaticity plot from a LED emission wavelength of the corresponding one of the plurality of LEDs.
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