CPC H01L 27/156 (2013.01) [H01L 21/67144 (2013.01); H01L 21/6835 (2013.01); H01L 25/0753 (2013.01); H01L 33/0095 (2013.01); H01L 33/60 (2013.01); H05K 3/0026 (2013.01); H05K 3/305 (2013.01); H05K 13/0015 (2013.01); H05K 13/0069 (2013.01); H05K 13/0469 (2013.01); H01L 33/20 (2013.01); H01L 33/48 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2933/0033 (2013.01)] | 11 Claims |
1. A method of transferring micro-devices, comprising:
attaching a plurality of micro-devices to a first surface of a first body with a first adhesive layer;
selectively forming a masking layer on a second surface of the first body on a side of the first body opposite the first surface;
while the plurality of micro-devices are attached to the first surface by the first adhesive layer, positioning a third surface of a second body relative to the first surface so that a second adhesive layer on the third surface abuts the plurality of micro-devices on a side of plurality of micro-devices opposite the first surface;
exposing the first adhesive layer to illumination through the first body to create a neutralized portion while the masking layer blocks the illumination from reaching at least some of first adhesive layer to provide a less exposed portion of the first adhesive layer that is more adhesive than the neutralized portion; and
separating the first surface from the second surface such that one or more micro-devices corresponding to the less exposed portion of the first adhesive layer remain attached to the first surface and one or more micro-devices corresponding to the neutralized portion are attached to the third surface and are separated from the first surface.
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