US 11,756,948 B2
In situ package integrated thin film capacitors for power delivery
Thomas Sounart, Chandler, AZ (US); Aleksandar Aleksov, Chandler, AZ (US); and Henning Braunisch, Phoenix, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on May 1, 2019, as Appl. No. 16/400,768.
Prior Publication US 2020/0350303 A1, Nov. 5, 2020
Int. Cl. H01L 27/01 (2006.01); H01L 21/47 (2006.01); H01L 23/522 (2006.01); H01L 49/02 (2006.01)
CPC H01L 27/016 (2013.01) [H01L 21/47 (2013.01); H01L 23/5223 (2013.01); H01L 23/5226 (2013.01); H01L 28/75 (2013.01)] 28 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
a thin film capacitor (TFC), the TFC comprising:
a first electrode;
a dielectric layer over the first electrode, wherein the dielectric layer comprises a first portion and a second portion on the first electrode, wherein a first opening is between the first portion and the second portion, wherein the first opening exposes a portion of the first electrode, wherein the dielectric layer comprises a high-k dielectric, and the TFC further comprising one or more barrier metals, wherein the one or more barrier metals contact the high-k dielectric; and
a second electrode over the dielectric layer, wherein the second electrode comprises a second opening positioned above the first opening, and wherein the second opening exposes the first opening and exposes the portion of the first electrode;
a first via positioned on the exposed portion of the first electrode; and
a second via positioned on an exposed surface of the second electrode.