CPC H01L 27/016 (2013.01) [H01L 21/47 (2013.01); H01L 23/5223 (2013.01); H01L 23/5226 (2013.01); H01L 28/75 (2013.01)] | 28 Claims |
1. An electronic package, comprising:
a thin film capacitor (TFC), the TFC comprising:
a first electrode;
a dielectric layer over the first electrode, wherein the dielectric layer comprises a first portion and a second portion on the first electrode, wherein a first opening is between the first portion and the second portion, wherein the first opening exposes a portion of the first electrode, wherein the dielectric layer comprises a high-k dielectric, and the TFC further comprising one or more barrier metals, wherein the one or more barrier metals contact the high-k dielectric; and
a second electrode over the dielectric layer, wherein the second electrode comprises a second opening positioned above the first opening, and wherein the second opening exposes the first opening and exposes the portion of the first electrode;
a first via positioned on the exposed portion of the first electrode; and
a second via positioned on an exposed surface of the second electrode.
|