US 11,756,919 B2
Wedge tool, bonding device, and bonding inspection method
Daisuke Imai, Hyogo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Appl. No. 16/766,042
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
PCT Filed Feb. 7, 2018, PCT No. PCT/JP2018/004187
§ 371(c)(1), (2) Date May 21, 2020,
PCT Pub. No. WO2019/155547, PCT Pub. Date Aug. 15, 2019.
Prior Publication US 2020/0395333 A1, Dec. 17, 2020
Int. Cl. H01L 23/00 (2006.01); H01L 21/50 (2006.01); H01L 21/60 (2006.01)
CPC H01L 24/78 (2013.01) [H01L 21/50 (2013.01); H01L 24/48 (2013.01); H01L 2021/60195 (2013.01); H01L 2224/48455 (2013.01); H01L 2224/78315 (2013.01); H01L 2224/78343 (2013.01); H01L 2224/859 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A wedge tool performing a wedge bonding by an ultrasonic vibration, comprising:
a groove which is formed along a direction of the ultrasonic vibration in a tip portion of the wedge tool and in which a bonding wire is disposed in a wedge bonding;
a first planar surface and a second planar surface disposed on both sides of the groove on the tip portion of the wedge tool; and
at least one convex portion formed away from the groove in at least one of the first planar surface and the second planar surface, wherein
the bonding wire comes in contact with the convex portion by a deformation of the bonding wire in a bonding part of the bonding wire and a bonded object bonded to each other by a wedge bonding, and
the convex portion is located in a central part of at least one of the first planar surface and the second planar surface in a direction in which the groove is formed.