US 11,756,911 B2
Metal pad modification
Krishna Tunga, Wappingers Falls, NY (US); and Ekta Misra, Carmel, NY (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Jun. 12, 2019, as Appl. No. 16/438,578.
Application 16/438,578 is a continuation of application No. 16/010,712, filed on Jun. 18, 2018, granted, now 10,373,925.
Application 16/010,712 is a continuation of application No. 15/636,038, filed on Jun. 28, 2017, granted, now 10,090,271, issued on Oct. 2, 2018.
Prior Publication US 2019/0295978 A1, Sep. 26, 2019
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/13 (2013.01) [H01L 24/05 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/056 (2013.01); H01L 2224/05012 (2013.01); H01L 2224/05015 (2013.01); H01L 2224/05025 (2013.01); H01L 2224/05027 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05686 (2013.01); H01L 2224/10126 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11464 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13027 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/13186 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/3512 (2013.01); H01L 2924/35121 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A structure comprising:
a base material;
at least one metal pad,
wherein a first surface of the metal pad is in contact with a surface of the base material;
a metal pedestal;
wherein a first surface of the metal pedestal is in contact with a second surface of the metal pad,
wherein the metal pad has a cross section that, when viewed in a top-down view, is an elliptical shape, and
wherein an axis running through a shortest diameter of the metal pad is perpendicular to a line running from the center of the metal pad to the center of the base material; and
a solder bump in contact with a second surface of the metal pedestal.