US 11,756,910 B2
Package for power electronics
Brice McPherson, Fayetteville, AR (US); Daniel Martin, Fayetteville, AR (US); and Jennifer Stabach, Fayetteville, AR (US)
Assigned to WOLFSPEED, INC., Durham, NC (US)
Filed by Wolfspeed, Inc., Durham, NC (US)
Filed on Dec. 21, 2021, as Appl. No. 17/557,322.
Application 17/352,965 is a division of application No. 16/441,925, filed on Jun. 14, 2019, granted, now 11,069,640, issued on Jul. 20, 2021.
Application 17/557,322 is a continuation of application No. 17/352,965, filed on Jun. 21, 2021.
Prior Publication US 2022/0115346 A1, Apr. 14, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 23/495 (2006.01); H01L 21/66 (2006.01)
CPC H01L 24/09 (2013.01) [H01L 24/49 (2013.01); H01L 25/072 (2013.01); H01L 22/14 (2013.01); H01L 22/30 (2013.01); H01L 22/32 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49558 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 2224/04042 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/30101 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package for power electronics comprising:
a power substrate;
a power switching conductive trace on the power substrate;
at least one power semiconductor die on the power switching conductive trace, the at least one power semiconductor die comprising:
a first power switching pad and a second power switching pad;
a control pad;
a semiconductor structure configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad; and
a Kelvin connection pad coupled to the second power switching pad on the at least one power semiconductor die;
a Kelvin conductive trace on the power substrate;
a Kelvin connection contact coupled to the Kelvin connection pad via the Kelvin conductive trace; and
a control conductive trace coupled to the control pad, wherein the control conductive trace is arranged on the power substrate and between the power switching conductive trace and the Kelvin conductive trace.