US 11,756,889 B2
Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making
Sanka Ganesan, Chandler, AZ (US); Kevin McCarthy, Tempe, AZ (US); Leigh M. Tribolet, Chandler, AZ (US); Debendra Mallik, Chandler, AZ (US); Ravindranath V. Mahajan, Chandler, AZ (US); and Robert L. Sankman, Phoenix, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Aug. 7, 2019, as Appl. No. 16/534,027.
Prior Publication US 2021/0043570 A1, Feb. 11, 2021
Int. Cl. H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01)
CPC H01L 23/5381 (2013.01) [H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/08 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/80 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/214 (2013.01); H01L 2224/80006 (2013.01); H01L 2224/80894 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/05442 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a bridge on a high-density packaging (HDP) substrate, wherein the bridge includes a hybrid layer;
a plurality of dies over the bridge and the HDP substrate, wherein the bridge is coupled between the plurality of dies and the HDP substrate, wherein the bridge is directly coupled to two dies of the plurality of dies with the hybrid layer, wherein a top surface of the hybrid layer of the bridge is directly on bottom surfaces of the plurality of dies, and wherein a bottom surface of the bridge is directly on a top surface of the HDP substrate;
a single encapsulation layer on the HDP substrate, the single encapsulation layer laterally surrounding the bridge and the plurality of dies; and
a plurality of through mold vias (TMVs) on the HDP substrate and in the single encapsulation layer, wherein the plurality of TMVs couple the HDP substrate to the plurality of dies, and wherein the plurality of TMVs have a thickness that is substantially equal to a thickness of the bridge.