US 11,756,845 B2
Copper foil with glass carrier and production method therefor
Yoshinori Matsuura, Ageo (JP); Takenori Yanai, Ageo (JP); and Toshimi Nakamura, Ageo (JP)
Assigned to MITSUI MINING & SMELTING CO., LTD., Tokyo (JP)
Appl. No. 16/971,154
Filed by MITSUI MINING & SMELTING CO., LTD., Tokyo (JP)
PCT Filed Feb. 13, 2019, PCT No. PCT/JP2019/005111
§ 371(c)(1), (2) Date Aug. 19, 2020,
PCT Pub. No. WO2019/163605, PCT Pub. Date Aug. 29, 2019.
Claims priority of application No. 2018-027929 (JP), filed on Feb. 20, 2018.
Prior Publication US 2020/0411396 A1, Dec. 31, 2020
Int. Cl. B32B 15/04 (2006.01); B32B 17/06 (2006.01); H01L 23/13 (2006.01); H01L 21/48 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H05K 1/09 (2006.01); C03C 17/09 (2006.01); C03C 17/36 (2006.01); C23C 14/18 (2006.01)
CPC H01L 23/13 (2013.01) [B32B 15/04 (2013.01); C03C 17/09 (2013.01); C03C 17/3639 (2013.01); C23C 14/185 (2013.01); H01L 21/4846 (2013.01); H01L 23/15 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H05K 1/09 (2013.01); C03C 2218/154 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A glass carrier-attached copper foil comprising:
a glass carrier;
a release layer provided on the glass carrier; and
a copper layer provided on the release layer and having a thickness of 0.1 to 3.0 μm,
wherein the glass carrier has, at least on its surface having the copper layer thereon, a plurality of flat regions each having a maximum height Rz of less than 1.0 μm as measured in accordance with JIS B 0601-2001; and a rough region having a maximum height Rz of 1.0 to 30.0 μm as measured in accordance with JIS B 0601-2001, the rough region having a pattern of lines that define the flat regions.