CPC H01L 23/10 (2013.01) [H01L 23/04 (2013.01); H01L 24/17 (2013.01); H01L 24/67 (2013.01); H01L 24/70 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/89 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 24/16 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/17517 (2013.01); H01L 2224/8109 (2013.01); H01L 2224/81075 (2013.01); H01L 2224/8182 (2013.01); H01L 2224/81122 (2013.01); H01L 2224/81815 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06575 (2013.01); H01L 2225/06593 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/3025 (2013.01)] | 17 Claims |
1. A semiconductor device, comprising:
a substrate;
a die attached over the substrate, wherein the die has a rectangular footprint and includes a center portion surrounded by peripheral portions;
interconnects extending vertically away from the die and electrically coupling the die to the substrate; and
a metal enclosure located under or over the center portion, continuously encircling the interconnects, and extending vertically between the substrate and the die, wherein the metal enclosure has a shape that is different than the rectangular footprint along a horizontal plane.
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