US 11,756,844 B2
Semiconductor device with a protection mechanism and associated systems, devices, and methods
Wei Zhou, Boise, ID (US); Bret K. Street, Meridian, ID (US); and Mark E. Tuttle, Meridian, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Feb. 8, 2021, as Appl. No. 17/170,120.
Application 16/775,163 is a division of application No. 15/693,230, filed on Aug. 31, 2017, granted, now 10,580,710, issued on Mar. 3, 2020.
Application 17/170,120 is a continuation of application No. 16/775,163, filed on Jan. 28, 2020, granted, now 10,943,842.
Prior Publication US 2021/0183716 A1, Jun. 17, 2021
Int. Cl. H01L 23/532 (2006.01); H01L 23/10 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 23/04 (2006.01); H01L 25/00 (2006.01)
CPC H01L 23/10 (2013.01) [H01L 23/04 (2013.01); H01L 24/17 (2013.01); H01L 24/67 (2013.01); H01L 24/70 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/89 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 24/16 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/17517 (2013.01); H01L 2224/8109 (2013.01); H01L 2224/81075 (2013.01); H01L 2224/8182 (2013.01); H01L 2224/81122 (2013.01); H01L 2224/81815 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06575 (2013.01); H01L 2225/06593 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/3025 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a substrate;
a die attached over the substrate, wherein the die has a rectangular footprint and includes a center portion surrounded by peripheral portions;
interconnects extending vertically away from the die and electrically coupling the die to the substrate; and
a metal enclosure located under or over the center portion, continuously encircling the interconnects, and extending vertically between the substrate and the die, wherein the metal enclosure has a shape that is different than the rectangular footprint along a horizontal plane.