CPC H01L 21/67248 (2013.01) [G01C 19/00 (2013.01); G01P 15/02 (2013.01); H01L 21/324 (2013.01); H01L 21/67103 (2013.01); H01L 23/4985 (2013.01); H01L 23/562 (2013.01)] | 19 Claims |
1. A substrate warpage monitoring apparatus comprising:
a sensing unit that is removably disposed on a substrate and is configured to detect warpage information of the substrate during a time when a treatment process is performed on the substrate; and
a processor operatively coupled to the sensing unit and configured to generate warpage state information of the substrate on the basis of the warpage information detected by the sensing unit,
wherein the sensing unit comprises a plurality of sensing modules disposed at positions spaced apart from each other on the substrate and configured to detect the warpage information generated at the respective positions at which the sensing modules are disposed, and
wherein the processor collects the warpage information detected by each of the sensing modules to generate the warpage state information.
|