| US 11,756,810 B1 | ||
| Detection of force applied by pick-up tool for transferring semiconductor devices | ||
| Oscar Torrents Abad, Cork (IE); Daniel Brodoceanu, Cork (IE); Ali Sengül, Zurich (CH); and Pooya Saketi, Cork (IE) | ||
| Assigned to Meta Platforms Technologies, LLC, Menlo Park, CA (US) | ||
| Filed by Meta Platforms Technologies, LLC, Menlo Park, CA (US) | ||
| Filed on Dec. 27, 2019, as Appl. No. 16/728,677. | ||
| Int. Cl. H01L 21/67 (2006.01); B25J 15/00 (2006.01); B65G 47/90 (2006.01); B81C 1/00 (2006.01); B25J 7/00 (2006.01); B81B 3/00 (2006.01) | ||
| CPC H01L 21/67144 (2013.01) [B65G 47/905 (2013.01); B81C 1/00142 (2013.01); B81C 1/0015 (2013.01); H01L 21/67253 (2013.01); H01L 21/67259 (2013.01); B25J 7/00 (2013.01); B81B 3/0035 (2013.01); B81B 2203/0109 (2013.01); B81B 2203/0145 (2013.01)] | 19 Claims |
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1. A pick-up tool comprising:
a first leg portion; a second leg portion; a bridge base portion between the first and second leg portions, the bridge base portion having a first sloped surface connected to the first leg portion, and a second sloped surface connected to the second leg portion; a tip mounted on the bridge base portion between the first sloped surface and the second sloped surface, the tip configured to engage with a semiconductor device for picking up the semiconductor device from a carrier substrate; and a deformable structure configured to detect a force applied by the pick-up tool on the semiconductor device, the deformable structure formed within at least one of the first leg portion and the second leg portion of the pick-up tool and configured to deform under the force. |