US 11,756,800 B2
Methods and systems of forming metal interconnect layers using engineered templates
Rashid Mavliev, Campbell, CA (US)
Filed by Rashid Mavliev, Campbell, CA (US)
Filed on Mar. 31, 2021, as Appl. No. 17/219,250.
Claims priority of provisional application 63/002,573, filed on Mar. 31, 2020.
Prior Publication US 2021/0305061 A1, Sep. 30, 2021
Int. Cl. H01L 21/48 (2006.01); H01L 23/528 (2006.01); H05K 3/10 (2006.01); H05K 3/24 (2006.01); H01L 21/683 (2006.01); C25D 17/00 (2006.01); C25D 5/02 (2006.01); B29C 33/42 (2006.01); H05K 3/06 (2006.01); C25D 7/06 (2006.01)
CPC H01L 21/485 (2013.01) [B29C 33/424 (2013.01); C25D 5/022 (2013.01); C25D 7/0678 (2013.01); C25D 17/001 (2013.01); H01L 21/6835 (2013.01); H01L 23/528 (2013.01); H05K 3/108 (2013.01); H05K 3/241 (2013.01); H01L 2221/1084 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/95115 (2013.01); H05K 3/062 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A method of forming a transferable metal interconnect layer (MIL), having a MIL design, for transferring to a device substrate, the method comprising:
depositing a seed layer on an engineered template, the engineered template comprising template features determined by the MIL design of the transferable MIL; and
selectively electroplating the transferable MIL into the template features over the seed layer,
wherein adhesion of the seed layer to the engineered template is below an adhesion threshold, corresponding to the device substrate, thereby allowing to transfer the transferable MIL from the engineered template to the device substrate while retaining the MIL design of the transferable MIL.