CPC H01L 21/02043 (2013.01) | 20 Claims |
1. A method of cleaning a surface of a substrate, comprising:
applying an alcohol treatment on a surface of the substrate, the alcohol treatment configured to provide surface reduction of a first metal oxide layer from an underlying metal layer on the substrate; and
applying a water treatment to the surface of the substrate simultaneously with the alcohol treatment, the water treatment configured to remove alcohol from the alcohol treatment from a second metal oxide layer different from the first metal oxide layer, wherein the second metal oxide layer separates a first low-k dielectric layer from a second low-k dielectric layer on the substrate.
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