US 11,756,728 B2
Wireless power transfer system with extended wireless charging range
Pavel Shostak, San Diego, CA (US); Oleg Los, Buffalo Grove, IL (US); Unnati Wadkar, Bangalore (IN); Jason Luzinski, Chicago, IL (US); Md. Nazmul Alam, Lombard, IL (US); Mark D. Melone, Frankfort, IL (US); Matt Zamborsky, Chicago, IL (US); Jacob Babcock, Chicago, IL (US); Alberto Peralta, Chicago, IL (US); and Christine Frysz, Orchard Park, NY (US)
Assigned to NuCurrent, Inc., Chicago, IL (US)
Filed by NuCurrent, Inc., Chicago, IL (US)
Filed on Mar. 4, 2022, as Appl. No. 17/686,745.
Application 17/686,745 is a continuation of application No. 16/517,058, filed on Jul. 19, 2019, granted, now 11,271,430.
Prior Publication US 2022/0407358 A1, Dec. 22, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01F 38/14 (2006.01); H02J 50/12 (2016.01); H01F 27/28 (2006.01); H01F 27/36 (2006.01); H02J 50/00 (2016.01)
CPC H01F 38/14 (2013.01) [H01F 27/2885 (2013.01); H01F 27/36 (2013.01); H02J 50/005 (2020.01); H02J 50/12 (2016.02)] 20 Claims
OG exemplary drawing
 
1. A power transmitter for wireless power transfer comprising:
a transmitting coil assembly comprising:
a magnetic backing;
a magnetic ring that surrounds at least a portion of the magnetic backing;
a magnetic core affixed to a given surface of the magnetic backing, wherein the magnetic backing extends beyond the magnetic core; and
a transmitting coil that surrounds the magnetic core, wherein the transmitting coil is configured to couple to a receiving coil of a wireless power receiver; and
a printed circuit board having one or more transmitting electronics electrically connected to the transmitting coil; and
a heat dissipater positioned between the transmitting coil assembly and the printed circuit board and thermally connected to the one or more transmitting electronics, wherein the heat dissipater is configured to dissipate heat generated by at least one or more of the transmitting coil, at least one of the one or more transmitting electronics, or any combinations thereof, and wherein at least a portion of the heat dissipater is positioned radially outward of the magnetic backing and ring and is configured to increase surface area on the heat dissipater for facilitating heat dissipation from one or more of the transmitting coil, the magnetic backing, magnetic ring, and magnetic core, one or more transmitting electronics, or any combinations thereof.