US 11,756,724 B2
Coil electronic component
Chan Yoon, Suwon-si (KR); Dong Hwan Lee, Suwon-si (KR); Dong Jin Lee, Suwon-si (KR); and Young Ghyu Ahn, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Sep. 27, 2019, as Appl. No. 16/586,537.
Claims priority of application No. 10-2018-0156895 (KR), filed on Dec. 7, 2018.
Prior Publication US 2020/0185148 A1, Jun. 11, 2020
Int. Cl. H01F 27/32 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 41/10 (2006.01)
CPC H01F 27/327 (2013.01) [H01F 27/2804 (2013.01); H01F 27/292 (2013.01); H01F 41/10 (2013.01); H01F 2027/2809 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A coil electronic component, comprising:
a support substrate;
a first coil pattern and a second coil pattern disposed on an upper surface and a lower surface of the support substrate, respectively, in a stacking direction;
an encapsulant covering at least portions of the support substrate and the first and second coil patterns; and
first and second external electrodes connected to the first and second coil patterns, respectively, and disposed on portions of a lower surface of the encapsulant in the stacking direction,
wherein at least one portion of a lower surface of the first coil pattern in the stacking direction is exposed from the encapsulant,
at least one portion of a lower surface of the second coil pattern in the stacking direction is exposed from the encapsulant,
the first and second external electrodes are respectively connected to the at least one portion of the lower surface of the first coil pattern and the at least one portion of the lower surface of the second coil pattern,
the first coil pattern and the first external electrode are connected to each other at a level higher than a lower surface of the support substrate, and
the first and second external electrodes cover the lower surface of the encapsulant.