CPC H01F 27/323 (2013.01) [C03B 19/06 (2013.01); C03C 3/091 (2013.01); C03C 4/16 (2013.01); H01F 17/0013 (2013.01); H01F 27/2804 (2013.01); H01F 27/29 (2013.01); C03C 2201/10 (2013.01); C03C 2201/32 (2013.01); H01F 2017/002 (2013.01); H01F 2017/0066 (2013.01); H01F 2017/0093 (2013.01)] | 15 Claims |
1. A multilayer coil component comprising:
a component element assembly in which an inner conductor is disposed, the component element assembly including a first dielectric glass layer in which the inner conductor is embedded and second dielectric glass layers that are thin layers disposed on respective principal surfaces of the first dielectric glass layer, a primary component of each of the first dielectric glass layer and the second dielectric glass layers being formed of a glass material and having a filler component containing at least quartz, and at least one second dielectric glass layer of the second dielectric glass layers having a lower quartz content than the first dielectric glass layer; and
an outer electrode disposed on the surface of the component element assembly,
wherein the quartz content in the first dielectric glass layer is 40 to 60 parts by weight relative to 100 parts by weight of the glass material, and the quartz content in the second dielectric glass layers is 43.4 to 50.1 parts by weight relative to 100 parts by weight of the glass material, and
a thickness of the at least one second dielectric glass layer after firing is 10 μm to 100 μm.
|