CPC H01F 19/08 (2013.01) [H01F 17/0013 (2013.01); H01F 2017/0066 (2013.01); H01F 2017/0086 (2013.01); H01F 2019/085 (2013.01); H01L 25/16 (2013.01)] | 26 Claims |
1. An integrated circuit comprising:
a first isolation barrier including first and second isolation layers without a metal layer between the first and second isolation layers, in which the first and second isolation layers each includes a respective pre-preg layer and form a first laminate having a first through-hole, the second isolation layer has opposite first and second sides, and the first side opposes the first isolation layer;
a first metal layer embedded in the second side of the second isolation layer, the first metal layer including a primary coil of a transformer;
a second isolation barrier including third and fourth isolation layers without a metal layer between the third and fourth isolation layers, in which the third and fourth isolation layers each includes a respective pre-preg layer and form a second laminate having a second through-hole, the fourth isolation layer has opposite third and fourth sides, and the third side opposes the third isolation layer;
a second metal layer embedded in the fourth side of the fourth isolation layer, the second metal layer including a secondary coil of the transformer;
magnetic material having a first magnetic portion over at least a portion of the first isolation barrier, a second magnetic portion over all of the second metal layer, and a third magnetic portion between the first and second magnetic portions and extending through the first and second through-holes; and
a lead frame on which the second magnetic portion is mounted, in which the second magnetic portion is between the second metal layer and the lead frame.
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