US 11,756,626 B2
Memory die resource management
Jiangang Wu, Milpitas, CA (US); James P. Crowley, Longmont, CO (US); and Yun Li, Fremont, CA (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Nov. 5, 2021, as Appl. No. 17/520,398.
Application 17/520,398 is a continuation of application No. 16/818,115, filed on Mar. 13, 2020, granted, now 11,189,347.
Prior Publication US 2022/0059169 A1, Feb. 24, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G11C 16/26 (2006.01); G11C 16/14 (2006.01); G06F 12/02 (2006.01); G06F 9/50 (2006.01)
CPC G11C 16/14 (2013.01) [G06F 9/5016 (2013.01); G06F 12/0246 (2013.01); G11C 16/26 (2013.01); G06F 2209/503 (2013.01); G06F 2209/508 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
determining, from a set of global resources, a set of die-specific resources allocated for a plurality of commands for a memory die;
receiving a command of the plurality of commands after determining the set of die-specific resources; and
determining whether to assign the command of the plurality of commands to a die-specific resource of the set of die-specific resources based at least in part on an availability of the die-specific resource.