US 11,755,874 B2
Methods and systems for heat applied sensor tag
Carlos Gomez Garcia, Boca Raton, FL (US); David Torrecilla, Boca Raton, FL (US); Olivier B. Sommer, Boca Raton, FL (US); Steven E. Trivelpiece, Boca Raton, FL (US); George H. West, Boca Raton, FL (US); and Fernando Pereira Mosqueira, Boca Raton, FL (US)
Assigned to SENSORMATIC ELECTRONICS, LLC, Boca Raton, FL (US)
Filed by Sensormatic Electronics, LLC, Boca Raton, FL (US)
Filed on Mar. 3, 2022, as Appl. No. 17/686,008.
Claims priority of provisional application 63/156,146, filed on Mar. 3, 2021.
Prior Publication US 2022/0284253 A1, Sep. 8, 2022
Int. Cl. G06K 19/077 (2006.01); G08B 13/24 (2006.01); G06K 19/02 (2006.01)
CPC G06K 19/0776 (2013.01) [G06K 19/027 (2013.01); G06K 19/0772 (2013.01); G08B 13/2417 (2013.01); G08B 13/2434 (2013.01); G08B 13/2445 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A method for configuring a sensor tag, comprising:
placing the sensor tag in a location on a garment or fabric to be affixed;
applying a heat source at a temperature to the sensor tag for a time period to melt an adhesive;
removing the heat source after the time period has elapsed; and
removing a top protective layer after removing the heat source,
wherein the adhesive layer comprises two different layers of adhesive.