CPC G01R 31/2891 (2013.01) [F25B 21/04 (2013.01); G01R 1/0458 (2013.01); G01R 31/2896 (2013.01)] | 27 Claims |
1. A test system comprising:
test sites for testing devices under test (DUTs), the test sites comprising a test site configured to hold a DUT for testing; and
a thermal control system to control a temperature of the DUT separately from control over temperatures of other DUTs in other test sites, the thermal control system comprising a thermoelectric cooler (TEC) and a structure that is thermally conductive, the TEC being in thermal communication with the DUT to control the temperature of the DUT by transferring heat between the DUT and the structure;
wherein the thermal control system comprises liquid coolant to flow through the structure to reduce a temperature of the structure.
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