CPC G01R 31/2875 (2013.01) [G01R 1/0458 (2013.01); G01R 31/2863 (2013.01); G01R 31/2867 (2013.01); G01R 31/2874 (2013.01)] | 24 Claims |
1. A method of placing a system-in-package device under test (DUT) in a socket using an automated handler system, said method comprising:
using a handler, automatically picking up said DUT from a tray and automatically placing said DUT into a socket, wherein said DUT is secured within said socket via first retention features disposed within said socket; and
using said handler, automatically picking up an active thermal interposer device and automatically placing said active thermal interposer device on top of said DUT within said socket, wherein said active thermal interposer device is secured within said socket via second retention features disposed within said socket and wherein further if said active thermal interposer device is placed within said socket by said handler and said DUT is not within said socket, then said first and second retention features are operable to prevent said active thermal interposer device from contacting pins of said socket.
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