US 11,754,510 B2
Inspection system of semiconductor wafer and method of driving the same
Doyoung Yoon, Suwon-si (KR); Jeongho Ahn, Suwon-si (KR); Dongryul Lee, Suwon-si (KR); Dongchul Ihm, Suwon-si (KR); and Chungsam Jun, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Oct. 14, 2021, as Appl. No. 17/501,318.
Prior Publication US 2023/0123710 A1, Apr. 20, 2023
Int. Cl. G01N 21/95 (2006.01); H01L 21/66 (2006.01); G01N 21/88 (2006.01); G01N 21/956 (2006.01)
CPC G01N 21/9501 (2013.01) [G01N 21/8806 (2013.01); G01N 21/956 (2013.01); H01L 22/12 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A semiconductor wafer inspection system comprising:
a wafer chuck disposed inside a chamber and on which a wafer is disposed;
a light source configured to emit light to the wafer so as to inspect a pattern on the wafer;
an inspection controller configured to control driving of the light source;
a cooling gas gun disposed adjacent to the light source and configured to spray a cooling gas on a surface of the wafer;
a temperature sensor configured to measure a temperature of the wafer chuck, generate a temperature value, and transmit the temperature value to a cooling controller; and
the cooling controller comprising:
a first cooler configured to generate and supply cooling air to the wafer chuck before light is emitted to the wafer;
a second cooler configured to generate and supply the cooling gas to the cooling gas gun; and
a driving controller configured to control driving of the first cooler based on the temperature of the wafer chuck and control driving of the second cooler based on a point in time at which light is emitted to the wafer.