CPC F21V 7/04 (2013.01) [F21V 7/24 (2018.02); F21V 17/06 (2013.01); F21V 19/0015 (2013.01); F21Y 2115/10 (2016.08)] | 12 Claims |
1. A simulated edge-emitting diode assembly, comprising:
a circuit substrate;
a surface-emitting diode mounted on the circuit substrate;
a surface mountable reflector affixed to the circuit substrate, the surface mountable reflector having opposite reflective side walls that diverge from a generally closed end toward an open end and a reflective roof that diverges from the closed end toward the open end, wherein the surface-emitting diode is located between the circuit substrate and the roof of the surface mountable reflector; and
a solder joint affixing the surface mountable reflector to the circuit substrate,
wherein the surface mountable reflector is fabricated of a metal sheet that has been cut and bent.
|