US 11,753,538 B2
Organic microgel system with di—and tri-block blends of herschel-bulkley fluid for 3D printing of sacrificial support structures
Thomas Ettor Angelini, Gainesville, FL (US); Brent S. Sumerlin, Gainesville, FL (US); Christopher S. O'Bryan, Gainesville, FL (US); Wallace Gregory Sawyer, Gainesville, FL (US); and Tapomoy Bhattacharjee, Gainesville, FL (US)
Assigned to UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC., Gainesville, FL (US)
Filed by University of Florida Research Foundation, Inc., Gainesville, FL (US)
Filed on Aug. 5, 2021, as Appl. No. 17/394,875.
Application 17/394,875 is a continuation of application No. 15/693,389, filed on Aug. 31, 2017, granted, now 11,124,644.
Claims priority of provisional application 62/382,652, filed on Sep. 1, 2016.
Prior Publication US 2021/0363340 A1, Nov. 25, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. C08L 53/00 (2006.01); C09D 11/102 (2014.01); B29C 64/40 (2017.01); B29C 64/112 (2017.01); B33Y 70/00 (2020.01); B33Y 10/00 (2015.01); C09D 11/10 (2014.01); B29C 64/106 (2017.01); C08L 53/02 (2006.01); B29K 105/00 (2006.01); B29K 9/00 (2006.01); B29K 96/04 (2006.01)
CPC C08L 53/00 (2013.01) [B29C 64/106 (2017.08); B29C 64/112 (2017.08); B29C 64/40 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C08L 53/025 (2013.01); C09D 11/10 (2013.01); C09D 11/102 (2013.01); B29K 2009/00 (2013.01); B29K 2096/04 (2013.01); B29K 2105/0085 (2013.01); C08L 2205/025 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A method of manufacturing a support material for supporting silicone-based ink in a 3D printing operation, the method comprising:
blending a di-block copolymer and a tri-block copolymer in an organic solvent to form a solvent mixture;
heating the solvent mixture to above a first temperature; and
cooling the solvent mixture to below the first temperature to form a plurality of microgel particles,
wherein the support material consists of the plurality of microgel particles;
and wherein the support material is a Herschel-Bulkley fluid having a yield stress of less than 100 Pascals.