	US 11,752,747 B2
	Sealant film, laminate film, and packaging material
Daiki Tomiya, Kitaadachi-gun (JP); Yuki Kaburagi, Kitaadachi-gun (JP); and Takashi Moriya, Kitaadachi-gun (JP)
Assigned to DIC CORPORATION, Tokyo (JP)
Filed by DIC Corporation, Tokyo (JP)
Filed on Dec. 20, 2022, as Appl. No. 18/68,577.
Claims priority of application No. 2022-010802 (JP), filed on Jan. 27, 2022.
Prior Publication US 2023/0234346 A1, Jul. 27, 2023
Int. Cl. B32B 27/32 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 37/12 (2006.01)

CPC B32B 27/32 (2013.01) [B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 37/1207 (2013.01); B32B 2037/1223 (2013.01); B32B 2250/03 (2013.01); B32B 2250/24 (2013.01); B32B 2274/00 (2013.01); B32B 2307/31 (2013.01); B32B 2307/702 (2013.01); B32B 2323/00 (2013.01)]

10 Claims

1. A sealant film comprising a surface resin layer (A), an adhesive resin layer (B), a release resin layer (C), and a heat seal resin layer (D) that are laminated, wherein

the adhesive resin layer (B) contains a thermoplastic elastomer (b1) and a tackifier resin (b2),

the release resin layer (C) contains 40% by mass or more of an ethylene ionomer (c1) with a polar group concentration exceeding 5.5 mol % in a resin component contained in the release resin layer (C),

the release resin layer (C) further contains 0 to 60% by mass of an ethylene ionomer (c2) with a polar group concentration of 5.5 mol % or less in the resin component contained in the release resin layer (C), and

the heat seal resin layer (D) contains an ethylene resin (d1).