CPC B24B 37/015 (2013.01) [B24B 37/105 (2013.01); B24B 37/22 (2013.01); B24B 37/34 (2013.01); B24B 55/02 (2013.01); B24B 37/042 (2013.01); B24B 49/14 (2013.01); B24B 53/017 (2013.01)] | 19 Claims |
1. A chemical mechanical polishing apparatus comprising:
a platen having a top surface to hold a polishing pad;
a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process;
a temperature monitoring system including a non-contact thermal sensor positioned above the platen to have a field of view of a portion of the polishing pad on the platen, the thermal sensor rotatable by a motor about an axis of rotation parallel to the polishing surface so as to move the field of view across the polishing pad.
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