US 11,752,589 B2
Chemical mechanical polishing temperature scanning apparatus for temperature control
Hari Soundararajan, Sunnyvale, CA (US); Shou-Sung Chang, Mountain View, CA (US); Haosheng Wu, San Jose, CA (US); and Jianshe Tang, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Apr. 15, 2020, as Appl. No. 16/849,863.
Claims priority of provisional application 62/835,990, filed on Apr. 18, 2019.
Prior Publication US 2020/0331113 A1, Oct. 22, 2020
Int. Cl. B24B 37/015 (2012.01); B24B 37/10 (2012.01); B24B 37/22 (2012.01); B24B 37/34 (2012.01); B24B 55/02 (2006.01); B24B 49/14 (2006.01); B24B 37/04 (2012.01); B24B 53/017 (2012.01)
CPC B24B 37/015 (2013.01) [B24B 37/105 (2013.01); B24B 37/22 (2013.01); B24B 37/34 (2013.01); B24B 55/02 (2013.01); B24B 37/042 (2013.01); B24B 49/14 (2013.01); B24B 53/017 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A chemical mechanical polishing apparatus comprising:
a platen having a top surface to hold a polishing pad;
a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process;
a temperature monitoring system including a non-contact thermal sensor positioned above the platen to have a field of view of a portion of the polishing pad on the platen, the thermal sensor rotatable by a motor about an axis of rotation parallel to the polishing surface so as to move the field of view across the polishing pad.