US 11,752,556 B2
Lamination shaping copper powder and laminated and shaped product
Yuji Sugitani, Kyoto (JP); Yoshito Nishizawa, Shiga (JP); Takeshi Maruyama, Shiga (JP); and Hiroaki Okubo, Shiga (JP)
Assigned to FUKUDA METAL FOIL & POWDER CO., LTD., Kyoto (JP); and TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING, Tokyo (JP)
Appl. No. 16/631,832
Filed by FUKUDA METAL FOIL & POWDER CO., LTD., Kyoto (JP); and TECHNOLOGY RESEARCH ASSOCIATION FOR FUTURE ADDITIVE MANUFACTURING, Tokyo (JP)
PCT Filed Jul. 18, 2017, PCT No. PCT/JP2017/026000
§ 371(c)(1), (2) Date Jan. 16, 2020,
PCT Pub. No. WO2019/016874, PCT Pub. Date Jan. 24, 2019.
Prior Publication US 2020/0147682 A1, May 14, 2020
This patent is subject to a terminal disclaimer.
Int. Cl. B22F 1/00 (2022.01); B22F 10/28 (2021.01); B33Y 70/00 (2020.01); B33Y 80/00 (2015.01)
CPC B22F 10/28 (2021.01) [B22F 1/00 (2013.01); B33Y 70/00 (2014.12); B22F 2301/10 (2013.01); B22F 2999/00 (2013.01); B33Y 80/00 (2014.12)] 15 Claims
OG exemplary drawing
 
1. A copper powder for lamination shaping, the copper powder comprising particles, each of the particles including a tin element and pure copper, wherein an amount of the tin element in the copper powder is equal to or more than 0.5 wt %, and equal to or less than 6.0 wt %, wherein a flow rate of particles in the copper powder is in the range of 12.2-18.1 s/50 g when measured by a measurement method of JIS Z 2502.2.