CPC H10N 50/80 (2023.02) [H01L 21/768 (2013.01); H01L 23/5384 (2013.01); H10B 61/22 (2023.02); H10B 63/30 (2023.02); H10N 50/01 (2023.02); H10N 50/10 (2023.02); H10N 70/011 (2023.02); H10N 70/20 (2023.02); H10N 70/841 (2023.02); H10N 70/8833 (2023.02)] | 20 Claims |
1. An integrated circuit (IC) comprising:
a first conductive feature;
a memory cell overlying the first conductive feature; and
a second conductive feature extending from the memory cell to the first conductive feature and comprising a lower conductive body, an upper conductive body, and a conductive liner, wherein the upper conductive body fully covers the lower conductive body when viewed in profile, wherein the conductive liner extends along a bottom surface of the lower conductive body and individual sidewalls of the lower and upper conductive bodies, and wherein a top surface of the lower conductive body and a bottom surface of upper conductive body directly contact each other.
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